Purpose and use: Alloy tweezers designed as the main tool for 0.15 mm mainboard jumper maintenance, enabling precise handling of tiny jumpers on smartphone boards. Material and design: Made from alloy for durability with precision tips suitable for micro scale work. Scope of use: Designed for phone under a scope, especially cell phone jump line and metal wire work on mobile phone motherboards. Advantages: The tweezer is optimized for phone under a scope, providing accurate positioning for welding and copper wire soldering on the cell phone motherboard. Specifications to note: 0.15 mm mainboard jumper maintenance compatibility; suitable for delicate electronics work on smartphone boards. Practical use scenarios: 1) Under a microscope, maintain and reposition 0.15 mm jumpers on a smartphone mainboard. 2) jump lines in cell phones, including precise welding and alignment tasks on the motherboard. 3) Solder copper wire during mobile phone motherboard repairs, where small, controlled handling is required. Care and handling: Use gentle pressure to avoid bending tips, clean after use, and store in a safe place to maintain tip integrity. Summary of value: Provides precise, reliable handling for delicate smartphone motherboard work, improving accuracy in jumper maintenance, welding, and copper wire soldering tasks.