Features: Aim to fill the gaps between the heating element and the cooling unit; increasing the contact area for better thermal conductivity. Make your device temperature drop, reduce the loudnesses of your device and improve the comfort of use. Thermal compound pastes is easy to use and can be easily and accurately distributed on your processor or graphics card. Excellent thermal conductivity, long-term durability. Widely used for cooling IC-processors, graphics cards, CPU, GPU and heat sinks in computers and game consoles. Specifications: Material: Silicone Grease Model: TF8 Thermal Conductivity: 13.8W/m-K Color: Gray Thermal Impedance (℃-cm2/W): less than 0.01 Specific-gravity(25℃): 2.9g/cm³ Applicable Temperature Range: -220℃ / 380℃ Content: 2g, 5.8g(optional) Electrically Conductive: NO Harmless: YES Package Includes: 1x TF8 Thermal Silicone Grease(2g/5.8g optional) note: Please allow 0-1cm error due to manual measurement. Please allow for slight color difference due to different display resolution.