[Multi-Function Heating] Suitable for tinning, chip glue removal, separation preheating, and mainboard layering operations. [Intelligent Temperature Control] Offers precise temperature regulation from ambient to a maximum of 380°C. [Modular Design] Features strong compatibility and can be freely switched according to specific needs. [Large Operating Area] Supports larger motherboard desoldering operations for convenient and fast work. [Versatile Application] Ideal for various tasks including tinning, chip glue removal, separation preheating, and mainboard layering. Specifications: Temperature Range: Ambient to 380℃ Functions: Tinning, chip glue removal, separation preheating, mainboard layering Design: Modular with interchangeable components Operating Area: Large, suitable for extensive motherboard operations Temperature Control: Intelligent system