Features 1、Strong continuous printing performance, suitable for welding fine pitch IC, for BGA and relatively precise components. 2、Good wettability and mold release, strong resistance to cold and hot collapse, it is dry resistance. 3、Suitable for PCB welding with various high-required materials, fine pitch and high-precision components, and there is little phenomenon of shifting and short tombstoning. 4、The tin is full of bright tin beads, the residue is less white and transparent, and there is no strong corrosive substances such as fluorine. 5、It is active and rinse-free with less residual, high in antioxidants. Specification Condition: 100% Brand New Item Type: Normal Temperature Solder Paste Material: ABS, Solder Paste Color: As Pictures Shown Weight: Approx. 47g(With Tube) Model: SFD-229 Ingredients: Sn62.8/Ag0.4 Grain :20-38um (No. 4 Powder) Applicable: Mobile Phone Hard Disk CPU, IC, etc Melting Point: 183° C Function: for Mobile Phone Maintenance Package List 1 x Normal Temperature Solder Paste