- Provides precise testing and burn-in aging for QFP64, LQFP64, and TQFP64 chips, with a burn-in base to enhance stability and reliability. - Improves burn-in socket workflows and guarantees compatibility with QFP64/LQFP64/TQFP64 packages for consistent results. - Robust socket construction delivers safe, accurate testing and reliable performance during extended aging tests. - Designed to fit standard QFP64 footprints, supporting function, compatibility, and long-term use in professional settings. - Ideal for semiconductor engineers, electronics lab technicians, and personnel performing professional chip testing and aging processes. - Use scenarios: 1) In a production burn-in line to test QFP64 family devices for reliability during extended operation. 2) In R&D labs to study aging characteristics of QFP64/LQFP64/TQFP64 devices under extended aging tests. 3) In QA/QC or prototype validation to verify socket compatibility across batches and ensure consistent test results.