Stable Material: Incorporates longevity extension technology with oxidationresistant materials to maintain stable functionality during motherboard fingerprint and sustained electrical use. Space Optimization: Engineered for confinedspace repairs. The Phone Jump Wire improves adhesion and provides uniform, rapid melting to ensure seamless compatibility with microwelding equipment. Stable Circuit Connection: Delivers reliable signal stability with a noattenuation design, while boosting electrical conductivity and optimizing silver content to support frequency circuit repairs effectively. Unmatched Durability and Flexibility: Built for mechanical durability and nofracture stretching; the stranded twisting process reinforces bend resistance for extreme stress tolerance in demanding conditions. Usage scenarios Repairing motherboards where fingerprint sensors require stable operation and precise electrical continuity. Performing microwelding in tight or restricted spaces on smartphones or compact devices, where adhesion and rapid melting improve reliability. Conducting frequency circuit repairs that demand stable signal transmission, enhanced conductivity, and robust bend resistance.