Features: Rosin solder paste flux, made of no acid, lead-free- soldering flux paste which is not easy to dump. -BGA flux paste, easy to tin-, less residue-. High-purity,good helper for repairing and welding. Application: for Phone Motherboard- BGA- Soldering Repair Function: for Phone PCBs, PC Cards, PGA-, SMD- Rework Suitable for: for Phone PC Cards and Other Sophisticated Electronic Chip-level Flux Welding Specifications: Material: Rosin Soldering Paste Color: As Pictures Size:approx 24x57mm/0.94x2.24in Capacity:30g Type: Rosin-based Soldering Flux Paste Model Number: Welding Flux Application: for Phone Motherboard-BGA Soldering Repair Function: for Phone PCBs, PC Cards, PGA-, SMD- Rework Neutral: PH7+ - 0.3 Suitable for: for Phone PC Cards and Other Sophisticated Electronic Chip-level Flux Welding Note: Before welding, the welding site and welding wire should be cleaned. Due to the problems of lighting effects and shooting angles, there will be certain tolerances in the product, please understand. Please allow 0-1cm error due to the manual measurment. Package includes: 1PC x Welding Flux