Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging

₩94,990
+ ₩36,799 Shipping

Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging

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Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging

Price: ₩94,990
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₩94,990
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Description

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI) power
  • Brand: Taylor & Francis Ltd
  • Category: Computing & Internet
  • Format: Paperback
  • Language: English
  • Publication Date: 2022-01-24
  • Publisher / Label: Taylor & Francis Ltd
  • Author: Xing-Chang Wei
  • Number of Pages: 322
  • Fruugo ID: 344375769-754014932
  • ISBN: 9780367573669

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  • STANDARD: ₩36,799 - Delivery between Fri 05 December 2025–Thu 25 December 2025

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